A3R12E40DBF-8EA by ZENTEL ELECTRONICS CORP | Sourcengine

ZENTEL ELECTRONICS CORP A3R12E40DBF-8EA

Lifecycle status
Contact Mfr
RoHS
RoHS compliant
Description
DDR2 DRAM, 32MX16, CMOS, PBGA84
Category
Semiconductors Memory ICs DRAMs DDR2 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.28
SB Code
8542.32.00.15

Width
8 mm
Length
12.5 mm
Technology
CMOS
Access Mode
FOUR BANK PAGE BURST
JESD-30 Code
R-PBGA-B84
Memory Width
16
Organization
32MX16
Package Code
TFBGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
536870912 bit
Memory IC Type
DDR2 DRAM
Operating Mode
SYNCHRONOUS
Terminal Pitch
0.8 mm
Number of Ports
1
Number of Words
33554432 words
Screening Level
AEC-Q100
Seated Height-Max
1.2 mm
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH
Number of Functions
1
Number of Terminals
84
Number of Words Code
32M
Package Body Material
PLASTIC/EPOXY
Operating Temperature-Max
105 Cel
Operating Temperature-Min
-40 Cel
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED