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A3P1000-FGG144YI

Microsemi Corporation

Microsemi Corporation A3P1000-FGG144YI
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.60
  • Technology
    CMOS
  • Width (mm)
    13
  • Length (mm)
    13
  • JESD-30 Code
    S-PBGA-B144
  • Organization
    24576 CLBS, 1000000 GATES
  • Package Code
    LBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Number of CLBs
    24576
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    144
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.55
  • Supply Voltage-Max (V)
    1.575
  • Supply Voltage-Min (V)
    1.425
  • Supply Voltage-Nom (V)
    1.5
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    BGA144,12X12,40
  • Moisture Sensitivity Level
    3
  • Number of Equivalent Gates
    1000000
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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A3P1000-FGG144YI