A32300DX-BGG313I

Microsemi Corporation

Microsemi Corporation A32300DX-BGG313I
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.60
  • Technology
    CMOS
  • Width (mm)
    35
  • Length (mm)
    35
  • JESD-30 Code
    S-PBGA-B313
  • Organization
    1888 CLBS, 30000 GATES
  • Package Code
    IBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, INTERSTITIAL PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Number of CLBs
    1888
  • Terminal Finish
    TIN SILVER COPPER
  • Number of Inputs
    254
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    254
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    313
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.52
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    BGA313,25X25,50
  • Moisture Sensitivity Level
    3
  • Number of Equivalent Gates
    30000
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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A32300DX-BGG313I
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A32300DX-BGG313I