ProductsManufacturers
Events
Send an RFQBOM Tool

93CX66PM

INTEGRATED CIRCUIT TECHNOLOGY CORP

93CX66PM Datasheet
INTEGRATED CIRCUIT TECHNOLOGY CORP 93CX66PM
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • JESD-30 Code
    R-PDIP-T8
  • Memory Width
    16
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    EEPROM
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    MICROWIRE
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Write Protection
    HARDWARE/SOFTWARE
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    256X16
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    2.54
  • Number of Words Code
    256
  • Memory Density (bits)
    4096
  • Package Body Material
    PLASTIC/EPOXY
  • Data Retention Time-Min
    40
  • Number of Words (words)
    256
  • Standby Current-Max (A)
    0.0002
  • Supply Current-Max (mA)
    8
  • Package Equivalence Code
    DIP8,.3
  • Endurance (Write/Erase Cycles)
    10000
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

0 suppliers available to buy or to bid for 93CX66PM

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
93CX66PM
Send an RFQ
93CX66PM