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8X305-10/BYC

PHILIPS SEMICONDUCTORS

PHILIPS SEMICONDUCTORS 8X305-10/BYC
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.15
  • SB Code
    8542.31.00.15
  • Bit Size
    8
  • Technology
    TTL
  • Speed (MHz)
    10
  • JESD-30 Code
    R-CDFP-F52
  • Package Code
    DFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Terminals
    52
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Supply Voltage-Nom (V)
    5
  • Package Equivalence Code
    FL52,.7
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

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8X305-10/BYC
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8X305-10/BYC