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8V89316BAG

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 8V89316BAG
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    15
  • Length (mm)
    15
  • JESD-30 Code
    S-PBGA-B196
  • Package Code
    LBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    196
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.69
  • Supply Voltage-Nom (V)
    3.3
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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8V89316BAG
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8V89316BAG