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89TSF553BL

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 89TSF553BL
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    35
  • Length (mm)
    35
  • JESD-30 Code
    S-PBGA-B960
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    960
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.29
  • Supply Voltage-Max (V)
    1.89
  • Supply Voltage-Min (V)
    1.71
  • Supply Voltage-Nom (V)
    1.8
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    0

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89TSF553BL
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89TSF553BL