89HPES3T3ZBBCG8 by Integrated Device Technology, Inc. | Sourcengine

Integrated Device Technology, Inc. 89HPES3T3ZBBCG8

Lifecycle status
Transferred
RoHS
RoHS compliant
REACH
REACH compliant
Description
CABGA 13.00x13.00x1.40 mm 1.00mm Pitch
Category
Semiconductors UPs/uCs/Peripheral ICs Bus Controllers BUS CONTROLLER, PCI

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Technology
CMOS
Width (mm)
13
Length (mm)
13
JESD-30 Code
S-PBGA-B144
Package Code
LBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Terminal Finish
TIN SILVER COPPER
Address Bus Width
0
Bus Compatibility
PCI; SMBUS
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Number of Terminals
144
Terminal Pitch (mm)
1
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.5
Supply Voltage-Max (V)
1.1
Supply Voltage-Min (V)
0.9
Supply Voltage-Nom (V)
1
External Data Bus Width
0
Package Equivalence Code
BGA144,12X12,40
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, PCI
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
30