89HPEB383ZBNQG by Integrated Device Technology, Inc. | Sourcengine

Integrated Device Technology, Inc. 89HPEB383ZBNQG

Lifecycle status
Transferred
RoHS
RoHS compliant
REACH
REACH compliant
Description
VFQFPN 10.00x10.00x0.90 mm 0.50mm Pitch
Category
Semiconductors UPs/uCs/Peripheral ICs Bus Controllers BUS CONTROLLER, PCI

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Technology
CMOS
Width (mm)
10
Length (mm)
10
JESD-30 Code
S-XQCC-N132
Package Code
HVQCCN
Package Shape
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Meter
Surface Mount
YES
Terminal Form
NO LEAD
J-STD-609 Code
e3
Terminal Finish
Matte Tin (Sn)
Address Bus Width
32
Bus Compatibility
ISA; PCI; SBUS; VGA; USB
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Number of Terminals
132
Terminal Pitch (mm)
0.5
Package Body Material
UNSPECIFIED
Seated Height-Max (mm)
0.9
Supply Voltage-Max (V)
1.155
Supply Voltage-Min (V)
0.945
Supply Voltage-Nom (V)
1.05
External Data Bus Width
32
Clock Frequency-Max (MHz)
100
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, PCI
Data Transfer Rate-Max (MBps)
2500
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
30