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89H10T4BG2ZBBCG

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 89H10T4BG2ZBBCG
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    19
  • Length (mm)
    19
  • JESD-30 Code
    S-PBGA-B324
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Address Bus Width
    0
  • Bus Compatibility
    ISA, SMBUS, VGA
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    324
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.72
  • Supply Voltage-Max (V)
    1.1
  • Supply Voltage-Min (V)
    0.9
  • Supply Voltage-Nom (V)
    1
  • External Data Bus Width
    0
  • Supply Current-Max (mA)
    781
  • Package Equivalence Code
    BGA324,18X18,40
  • Clock Frequency-Max (MHz)
    125
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    BUS CONTROLLER, PCI
  • Data Transfer Rate-Max (MBps)
    12000
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

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89H10T4BG2ZBBCG