8305-2301
CONEXCON GROUP
- Lifecycle statusContact Mfr
- DescriptionIC Socket, DIP30, 30 Contact(s), 1.778mm Term Pitch, 10.16mm Row Spacing, Solder
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8536.69.40.40
- SB Code8536.69.40.40
- Body Depth0.201 inch
- Body Length1.05 inch
- Body Breadth0.496 inch
- Contact StyleBELLOWED TYPE
- Mounting StyleSTRAIGHT
- Terminal Pitch1.778 mm
- Contact MaterialP-CUSN
- Housing MaterialGLASS FILLED POLYESTER
- Termination TypeSOLDER
- Additional FeatureLOW PROFILE
- Device Socket TypeIC SOCKET
- Number of Contacts30
- Device Type Used OnDIP30
- PCB Contact PatternRECTANGULAR
- Mating Contact Pitch0.07 inch
- Contact Finish - MatingSN
- PCB Contact Row Spacing10.16 mm
- Contact Finish - TerminationTIN
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8305-2301
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8305-2301