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8003-28T3

OUPIIN AMERICA, INC.

OUPIIN AMERICA, INC. 8003-28T3
  • Lifecycle status
    Contact Mfr
  • RoHS
    RoHS compliant
  • REACH
    REACH compliant
  • Description
    IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder
  • Category
    Interconnects Sockets and Chip Carriers
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8536.69.40.40
  • SB Code
    8536.69.40.40
  • Body Depth
    0.201 inch
  • Body Length
    1.4 inch
  • Body Breadth
    0.4 inch
  • Contact Style
    LEAF
  • JESD-609 Code
    e3
  • Current Rating
    1 A
  • Mounting Style
    STRAIGHT
  • Terminal Pitch
    2.54 mm
  • Contact Material
    P-CUSN
  • Housing Material
    GLASS FILLED POLYBUTYLENE TEREPHTHALATE
  • Termination Type
    SOLDER
  • Additional Feature
    HIGH RELIABILITY
  • Device Socket Type
    IC SOCKET
  • Number of Contacts
    28
  • Device Type Used On
    DIP28
  • PCB Contact Pattern
    RECTANGULAR
  • Mating Contact Pitch
    0.1 inch
  • Insulation Resistance
    5000000000 ohm
  • Contact Finish - Mating
    SN
  • PCB Contact Row Spacing
    7.62 mm
  • Operating Temperature-Max
    105 Cel
  • Operating Temperature-Min
    -55 Cel
  • Contact Finish - Termination
    Tin (Sn)

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8003-28T3
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8003-28T3