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79RV3081E20PFB

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 79RV3081E20PFB
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Format
    FLOATING POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    20
  • Speed (MHz)
    20
  • JESD-30 Code
    R-PQFP-G100
  • Package Code
    LQFP
  • Boundary Scan
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Low Power Mode
    YES
  • Terminal Finish
    Tin/Lead (Sn85Pb15)
  • Integrated Cache
    YES
  • Address Bus Width
    32
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Number of Terminals
    100
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.6
  • Supply Voltage-Max (V)
    3.465
  • Supply Voltage-Min (V)
    3.135
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    32
  • Supply Current-Max (mA)
    375
  • Package Equivalence Code
    QFP100,.63SQ,20
  • Clock Frequency-Max (MHz)
    50
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Peak Reflow Temperature (Cel)
    240
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-STD-883 Class B
  • Time@Peak Reflow Temperature-Max (s)
    20

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79RV3081E20PFB