79RC32K438233BBI
Integrated Device Technology, Inc.
- Lifecycle statusTransferred
- DescriptionPBGA 27.00x27.00x2.23 mm 1.00mm Pitch
- Category
- ECCN3A991.a.2
- ECCN GovernanceEAR
- HTS Code8542.31.00.25
- SB Code8542.31.00.25
- FormatFIXED POINT
- Bit Size32
- TechnologyCMOS
- Width (mm)27
- Length (mm)27
- Speed (MHz)233
- JESD-30 CodeS-PBGA-B416
- Package CodeBGA
- Boundary ScanYES
- Package ShapeSQUARE
- Package StyleGRID ARRAY Meter
- Surface MountYES
- Terminal FormBALL
- J-STD-609 Codee0
- Low Power ModeNO
- Terminal FinishTIN LEAD
- Integrated CacheYES
- Address Bus Width32
- DLA QualificationNot Qualified
- Temperature GradeINDUSTRIAL
- Terminal PositionBOTTOM
- Number of Terminals416
- Terminal Pitch (mm)1
- Package Body MaterialPLASTIC/EPOXY
- Seated Height-Max (mm)2.44
- Supply Voltage-Max (V)1.3
- Supply Voltage-Min (V)1.1
- Supply Voltage-Nom (V)1.2
- External Data Bus Width32
- Package Equivalence CodeBGA416,26X26,40
- Clock Frequency-Max (MHz)77.6
- Moisture Sensitivity Level3
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR, RISC
- Peak Reflow Temperature (Cel)225
- Operating Temperature-Max (Cel)85
- Operating Temperature-Min (Cel)-40
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79RC32K438233BBI