ProductsManufacturers
Events
Send an RFQBOM Tool

79LV0832XPQK-25

DATA DEVICE CORP

DATA DEVICE CORP 79LV0832XPQK-25
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Width (mm)
    43.3578
  • Length (mm)
    43.3578
  • JESD-30 Code
    S-XQFP-F96
  • Memory Width
    32
  • Package Code
    QFF
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Memory IC Type
    EEPROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Memory Organization
    256KX32
  • Number of Functions
    1
  • Number of Terminals
    96
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    250
  • Number of Words Code
    256K
  • Memory Density (bits)
    8388608
  • Package Body Material
    UNSPECIFIED
  • Seated Height-Max (mm)
    6.223
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    262144
  • Programming Voltage (V)
    3
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Write Cycle Time-Max (tWC) (ms)
    15

0 suppliers available to buy or to bid for 79LV0832XPQK-25

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
79LV0832XPQK-25
Send an RFQ
79LV0832XPQK-25