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75P52100S66BXI

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 75P52100S66BXI
  • Technology
    CMOS
  • JESD-30 Code
    X-PBGA-B304
  • Package Code
    BGA
  • JESD-609 Code
    e0
  • Package Shape
    UNSPECIFIED
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Telecom IC Type
    TELECOM CIRCUIT
  • Terminal Finish
    TIN LEAD
  • Terminal Position
    BOTTOM
  • Supply Voltage-Nom
    1.8 V
  • Number of Functions
    1
  • Number of Terminals
    304
  • Package Body Material
    PLASTIC/EPOXY
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    225
  • Time@Peak Reflow Temperature-Max (s)
    30

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75P52100S66BXI
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75P52100S66BXI