ProductsManufacturers
Events
Send an RFQBOM Tool

74HC7404P

PHILIPS SEMICONDUCTORS

PHILIPS SEMICONDUCTORS 74HC7404P
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PDIP-T18
  • Memory Width
    5
  • Organization
    64X5
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory IC Type
    OTHER FIFO
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    2.54 mm
  • Access Time-Max
    81 ns
  • Number of Words
    64 words
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    0.5 mA
  • Number of Terminals
    18
  • Number of Words Code
    64
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    DIP18,.3
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Clock Frequency-Max (fCLK)
    14 MHz

0 suppliers available to buy or to bid for 74HC7404P

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
74HC7404P
Send an RFQ
74HC7404P