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73M223-CP

SILICON SYSTEMS INC

SILICON SYSTEMS INC 73M223-CP
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    R-PDIP-T16
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Telecom IC Type
    MODEM
  • Data Rate (Mbps)
    0.0012
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Additional Feature
    HALF DUPLEX
  • Number of Functions
    1
  • Number of Terminals
    16
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    12
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    -25

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73M223-CP
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73M223-CP