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72V85L20PAGI

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 72V85L20PAGI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    6.1 mm
  • Length
    14 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G56
  • Memory Width
    9
  • Organization
    8KX9
  • Package Code
    TSSOP
  • JESD-609 Code
    e3
  • Output Enable
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    73728 bit
  • Memory IC Type
    OTHER FIFO
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    0.5 mm
  • Access Time-Max
    20 ns
  • Number of Words
    8192 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Matte Tin (Sn) - annealed
  • Seated Height-Max
    1.2 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Additional Feature
    RETRANSMIT
  • Supply Current-Max
    100 mA
  • Number of Functions
    1
  • Number of Terminals
    56
  • Standby Current-Max
    0.005 Amp
  • Number of Words Code
    8K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    TSSOP56,.3,20
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Clock Frequency-Max (fCLK)
    33.3 MHz
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    30

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72V85L20PAGI