72V85L15PAG8 by Integrated Device Technology, Inc. | Sourcengine

Lifecycle status
Transferred
RoHS
RoHS compliant
REACH
REACH compliant
Description
TSSOP 14.00x6.10x1.00 mm 0.50mm Pitch
Category
Semiconductors Memory Ics Fifos Bi Directional Fifo

SB Code
8542.32.00.70
HTS Code
8542.32.00.71
ECCN Governance
EAR
ECCN
EAR99

Width
6.1 mm
Length
14 mm
Cycle Time
25 ns
Technology
CMOS
JESD-30 Code
R-PDSO-G56
Memory Width
9
Organization
8KX9
Package Code
TSSOP
Sub Category
FIFOs
JESD-609 Code
e3
Output Enable
NO
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory Density
73728 bit
Memory IC Type
BI-DIRECTIONAL FIFO
Operating Mode
ASYNCHRONOUS
Power Supplies
3.3 V
Terminal Pitch
0.5 mm
Access Time-Max
15 ns
Number of Words
8192 words
Parallel/Serial
PARALLEL
Terminal Finish
MATTE TIN
Seated Height-Max
1.2 mm
Temperature Grade
COMMERCIAL
Terminal Position
DUAL
Additional Feature
RETRANSMIT
Supply Current-Max
0.1 mA
Number of Functions
1
Number of Terminals
56
Standby Current-Max
0.005 Amp
Number of Words Code
8K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
TSSOP56,.3,20
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
Clock Frequency-Max (fCLK)
40 MHz
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30