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72V83L20PAG

Renesas Electronics Corp.

Renesas Electronics Corp. 72V83L20PAG
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • Width (mm)
    6.1
  • Length (mm)
    14
  • JESD-30 Code
    R-PDSO-G56
  • Memory Width
    9
  • Package Code
    TSSOP
  • Output Enable
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e3
  • Memory IC Type
    BI-DIRECTIONAL FIFO
  • Operating Mode
    ASYNCHRONOUS
  • Cycle Time (ns)
    30
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Matte Tin (Sn) - annealed
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Additional Feature
    RETRANSMIT
  • Memory Organization
    2KX9
  • Number of Functions
    1
  • Number of Terminals
    56
  • Terminal Pitch (mm)
    0.5
  • Access Time-Max (ns)
    20
  • Number of Words Code
    2K
  • Memory Density (bits)
    18432
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    2048
  • Standby Current-Max (A)
    0.005
  • Supply Current-Max (mA)
    100
  • Package Equivalence Code
    TSSOP56,.3,20
  • Clock Frequency-Max (MHz)
    33.3
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

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72V83L20PAG
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72V83L20PAG