72V7260L15BBG
Integrated Device Technology, Inc.
- Lifecycle statusTransferred
- RoHSRoHS compliant
- REACHREACH compliant
- DescriptionPBGA 17.00x17.00x1.76 mm 1.00mm Pitch
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8542.32.00.71
- SB Code8542.32.00.70
- Width17 mm
- Length17 mm
- Cycle Time15 ns
- TechnologyCMOS
- JESD-30 CodeS-PBGA-B256
- Memory Width72
- Organization4KX72
- Package CodeBGA
- JESD-609 Codee1
- Output EnableYES
- Package ShapeSQUARE
- Package StyleGRID ARRAY Meter
- Surface MountYES
- Terminal FormBALL
- Memory Density294912 bit
- Memory IC TypeOTHER FIFO
- Operating ModeSYNCHRONOUS
- Terminal Pitch1 mm
- Access Time-Max10 ns
- Number of Words4096 words
- Parallel/SerialPARALLEL
- Terminal FinishTIN SILVER COPPER
- Seated Height-Max3.5 mm
- Temperature GradeCOMMERCIAL
- Terminal PositionBOTTOM
- Additional FeatureRETRANSMIT
- Supply Current-Max75 mA
- Number of Functions1
- Number of Terminals256
- Standby Current-Max0.015 Amp
- Number of Words Code4K
- Qualification StatusNot Qualified
- Package Body MaterialPLASTIC/EPOXY
- Package Equivalence CodeBGA256,16X16,40
- Operating Temperature-Max70 Cel
- Operating Temperature-Min0 Cel
- Supply Voltage-Max (Vsup)3.45 V
- Supply Voltage-Min (Vsup)3.15 V
- Supply Voltage-Nom (Vsup)3.3 V
- Clock Frequency-Max (fCLK)66.7 MHz
- Moisture Sensitivity Level3
- Peak Reflow Temperature (Cel)260
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72V7260L15BBG