Integrated Device Technology, Inc. 72V7230L10BBG8
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • Width (mm)
    17
  • Length (mm)
    17
  • JESD-30 Code
    S-PBGA-B256
  • Memory Width
    72
  • Package Code
    BGA
  • Output Enable
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Memory IC Type
    OTHER FIFO
  • Operating Mode
    SYNCHRONOUS
  • Cycle Time (ns)
    10
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN SILVER COPPER
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    RETRANSMIT
  • Memory Organization
    512X72
  • Number of Functions
    1
  • Number of Terminals
    256
  • Terminal Pitch (mm)
    1
  • Access Time-Max (ns)
    6.5
  • Number of Words Code
    512
  • Memory Density (bits)
    36864
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.5
  • Supply Voltage-Max (V)
    3.45
  • Supply Voltage-Min (V)
    3.15
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    512
  • Supply Current-Max (mA)
    75
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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