72V3623L15PF8 by Integrated Device Technology, Inc. | Sourcengine

Integrated Device Technology, Inc. 72V3623L15PF8

Lifecycle status
Transferred
Description
TQFP 20.00x14.00x1.40 mm 0.50mm Pitch
Category
Semiconductors Memory ICs FIFOs BI-DIRECTIONAL FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
Width (mm)
14
Length (mm)
20
JESD-30 Code
R-PQFP-G128
Memory Width
36
Package Code
LFQFP
Output Enable
YES
Package Shape
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e0
Memory IC Type
BI-DIRECTIONAL FIFO
Operating Mode
SYNCHRONOUS
Cycle Time (ns)
15
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Additional Feature
EASILY EXPANDABLE IN DEPTH AND WIDTH
Memory Organization
256X36
Number of Functions
1
Number of Terminals
128
Terminal Pitch (mm)
0.5
Access Time-Max (ns)
10
Number of Words Code
256
Memory Density (bits)
9216
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.6
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
3
Supply Voltage-Nom (V)
3.3
Number of Words (words)
256
Standby Current-Max (A)
0.0004
Supply Current-Max (mA)
400
Package Equivalence Code
QFP128,.63X.87,20
Clock Frequency-Max (MHz)
66.7
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
30