72V223L6BCG8
Renesas Electronics Corp.
- Lifecycle statusContact Mfr
- RoHSRoHS compliant
- REACHREACH compliant
- DescriptionFIFO Mem Sync Dual Depth/Width Uni-Dir 512 x 18/1K x 9 100-Pin CABGA T/R
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8542.32.00.71
- SB Code8542.32.00.70
- TechnologyCMOS
- Width (mm)11
- Length (mm)11
- JESD-30 CodeS-PBGA-B100
- Memory Width18
- Package CodeLBGA
- Output EnableYES
- Package ShapeSQUARE
- Package StyleGRID ARRAY, LOW PROFILE Meter
- Surface MountYES
- Terminal FormBALL
- Memory IC TypeOTHER FIFO
- Operating ModeSYNCHRONOUS
- Cycle Time (ns)6
- Parallel/SerialPARALLEL
- Temperature GradeCOMMERCIAL
- Terminal PositionBOTTOM
- Additional FeatureIT CAN ALSO BE CONFIGURED AS 1K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- Memory Organization512X18
- Number of Functions1
- Number of Terminals100
- Terminal Pitch (mm)1
- Access Time-Max (ns)4
- Number of Words Code512
- Memory Density (bits)9216
- Package Body MaterialPLASTIC/EPOXY
- Seated Height-Max (mm)1.5
- Supply Voltage-Max (V)3.45
- Supply Voltage-Min (V)3.15
- Supply Voltage-Nom (V)3.3
- Number of Words (words)512
- Supply Current-Max (mA)35
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Operating Temperature-Max (Cel)70
- Operating Temperature-Min (Cel)0
- Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
0 suppliers available to buy or to bid for 72V223L6BCG8
Send an RFQ
Your RFQ will be directly sent to our expert: Pari
Send an RFQ
72V223L6BCG8