72V221L10JG by Integrated Device Technology, Inc. | Sourcengine

Integrated Device Technology, Inc. 72V221L10JG

Lifecycle status
Transferred
RoHS
RoHS compliant
REACH
REACH compliant
Description
FIFO, 1KX9, 6.5ns, Synchronous, CMOS, PQCC32
Category
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
Width (mm)
11.4554
Length (mm)
13.9954
JESD-30 Code
R-PQCC-J32
Memory Width
9
Package Code
QCCJ
Output Enable
YES
Package Shape
RECTANGULAR
Package Style
CHIP CARRIER Meter
Surface Mount
YES
Terminal Form
J BEND
J-STD-609 Code
e3
Memory IC Type
OTHER FIFO
Operating Mode
SYNCHRONOUS
Cycle Time (ns)
10
Parallel/Serial
PARALLEL
Terminal Finish
Matte Tin (Sn) - annealed
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Memory Organization
1KX9
Number of Functions
1
Number of Terminals
32
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
6.5
Number of Words Code
1K
Memory Density (bits)
9216
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
3.556
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
3
Supply Voltage-Nom (V)
3.3
Number of Words (words)
1024
Standby Current-Max (A)
0.005
Supply Current-Max (mA)
20
Package Equivalence Code
LDCC32,.5X.6
Clock Frequency-Max (MHz)
100
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
30