72V01L25JG8 by Renesas Electronics Corp. | Sourcengine

Renesas Electronics Corp. 72V01L25JG8

Lifecycle status
Discontinued
RoHS
RoHS compliant
REACH
REACH compliant
Description
FIFO, 512X9, 25ns, Asynchronous, CMOS, PQCC32
Category
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
Width (mm)
11.43
Length (mm)
13.97
JESD-30 Code
R-PQCC-N32
Memory Width
9
Package Code
QCCN
Output Enable
NO
Package Shape
RECTANGULAR
Package Style
CHIP CARRIER Meter
Surface Mount
YES
Terminal Form
J BEND
J-STD-609 Code
e3
Memory IC Type
OTHER FIFO
Operating Mode
ASYNCHRONOUS
Cycle Time (ns)
35
Parallel/Serial
PARALLEL
Terminal Finish
Matte Tin (Sn) - annealed
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Memory Organization
512X9
Number of Functions
1
Number of Terminals
32
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
25
Number of Words Code
512
Memory Density (bits)
4608
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
2.79
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
3
Supply Voltage-Nom (V)
3.3
Number of Words (words)
512
Standby Current-Max (A)
0.005
Supply Current-Max (mA)
60
Package Equivalence Code
LCC32,.45X.55
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
30