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72T3665L10BB

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 72T3665L10BB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B208
  • Memory Width
    36
  • Organization
    4KX36
  • Package Code
    BGA
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    147456 bit
  • Memory IC Type
    OTHER FIFO
  • Operating Mode
    SYNCHRONOUS/ASYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Access Time-Max
    4.5 ns
  • Number of Words
    4096 words
  • Terminal Finish
    TIN LEAD
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    60 mA
  • Number of Terminals
    208
  • Standby Current-Max
    0.01 Amp
  • Number of Words Code
    4K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA208,16X16,40
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Clock Frequency-Max (fCLK)
    100 MHz
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    225
  • Time@Peak Reflow Temperature-Max (s)
    30

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72T3665L10BB
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72T3665L10BB