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72T20128L6-7BBI

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 72T20128L6-7BBI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B208
  • Memory Width
    20
  • Package Code
    BGA
  • Output Enable
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Memory IC Type
    OTHER FIFO
  • Operating Mode
    SYNCHRONOUS
  • Cycle Time (ns)
    7
  • Parallel/Serial
    SERIAL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    256KX20
  • Number of Functions
    1
  • Number of Terminals
    208
  • Terminal Pitch (mm)
    1
  • Access Time-Max (ns)
    3.8
  • Number of Words Code
    256K
  • Memory Density (bits)
    5242880
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    10
  • Supply Voltage-Nom (V)
    2.5
  • Number of Words (words)
    262144
  • Standby Current-Max (A)
    0.05
  • Supply Current-Max (mA)
    60
  • Package Equivalence Code
    BGA208,16X16,40
  • Clock Frequency-Max (MHz)
    150
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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72T20128L6-7BBI
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72T20128L6-7BBI