ProductsManufacturers
Events
Send an RFQBOM Tool

72T1875L10BBI

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 72T1875L10BBI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B144
  • Memory Width
    18
  • Package Code
    BGA
  • Output Enable
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    OTHER FIFO
  • Operating Mode
    SYNCHRONOUS/ASYNCHRONOUS
  • Cycle Time (ns)
    20
  • Parallel/Serial
    Parallel/Serial
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    16KX18
  • Number of Functions
    1
  • Number of Terminals
    144
  • Terminal Pitch (mm)
    1
  • Access Time-Max (ns)
    14
  • Number of Words Code
    16K
  • Memory Density (bits)
    294912
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    9
  • Supply Voltage-Nom (V)
    2.5
  • Number of Words (words)
    16384
  • Standby Current-Max (A)
    0.05
  • Supply Current-Max (mA)
    60
  • Package Equivalence Code
    BGA144,12X12,40
  • Clock Frequency-Max (MHz)
    50
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for 72T1875L10BBI

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
72T1875L10BBI
Send an RFQ
72T1875L10BBI