72T1865L5BBI
Integrated Device Technology, Inc.
- Lifecycle statusTransferred
- DescriptionPBGA 13.00x13.00x1.76 mm 1.00mm Pitch
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8542.32.00.71
- SB Code8542.32.00.70
- Width13 mm
- Length13 mm
- Cycle Time5 ns
- TechnologyCMOS
- JESD-30 CodeS-PBGA-B144
- Memory Width18
- Organization8KX18
- Package CodeBGA
- JESD-609 Codee0
- Output EnableYES
- Package ShapeSQUARE
- Package StyleGRID ARRAY Meter
- Surface MountYES
- Terminal FormBALL
- Memory Density147456 bit
- Memory IC TypeOTHER FIFO
- Operating ModeSYNCHRONOUS
- Terminal Pitch1 mm
- Access Time-Max3.6 ns
- Number of Words8192 words
- Parallel/SerialPARALLEL
- Terminal FinishTIN LEAD
- Seated Height-Max1.97 mm
- Temperature GradeINDUSTRIAL
- Terminal PositionBOTTOM
- Additional FeatureALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE
- Supply Current-Max60 mA
- Number of Functions1
- Number of Terminals144
- Standby Current-Max0.05 Amp
- Number of Words Code8K
- Qualification StatusNot Qualified
- Package Body MaterialPLASTIC/EPOXY
- Alternate Memory Width9
- Package Equivalence CodeBGA144,12X12,40
- Operating Temperature-Max85 Cel
- Operating Temperature-Min-40 Cel
- Supply Voltage-Max (Vsup)2.625 V
- Supply Voltage-Min (Vsup)2.375 V
- Supply Voltage-Nom (Vsup)2.5 V
- Clock Frequency-Max (fCLK)83 MHz
- Moisture Sensitivity Level3
- Peak Reflow Temperature (Cel)225
- Time@Peak Reflow Temperature-Max (s)30
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72T1865L5BBI