7282L25PA by Integrated Device Technology, Inc. | Sourcengine

Integrated Device Technology, Inc. 7282L25PA

Lifecycle status
Discontinued
Description
FIFO, 2KX9, 25ns, Asynchronous, CMOS, PDSO56
Category
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
JESD-30 Code
R-PDSO-G56
Memory Width
9
Organization
2KX9
Package Code
TSSOP
JESD-609 Code
e0
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory Density
18432 bit
Memory IC Type
OTHER FIFO
Operating Mode
ASYNCHRONOUS
Terminal Pitch
0.5 mm
Access Time-Max
25 ns
Number of Words
2048 words
Terminal Finish
TIN LEAD
Temperature Grade
COMMERCIAL
Terminal Position
DUAL
Supply Current-Max
125 mA
Number of Terminals
56
Number of Words Code
2K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
TSSOP56,.3,20
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Nom (Vsup)
5 V
Clock Frequency-Max (fCLK)
28.5 MHz
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
20