7282L15PA by Integrated Device Technology, Inc. | Sourcengine

Integrated Device Technology, Inc. 7282L15PA

Lifecycle status
Transferred
Description
TSSOP 14.00x6.10x1.00 mm 0.50mm Pitch
Category
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
Width (mm)
6.1
Length (mm)
14
JESD-30 Code
R-PDSO-G56
Memory Width
9
Package Code
TSSOP
Output Enable
NO
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e0
Memory IC Type
OTHER FIFO
Operating Mode
ASYNCHRONOUS
Cycle Time (ns)
25
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
DUAL
Additional Feature
RETRANSMIT
Memory Organization
1KX9
Number of Functions
2
Number of Terminals
56
Terminal Pitch (mm)
0.5
Access Time-Max (ns)
15
Number of Words Code
1K
Memory Density (bits)
9216
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.2
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
1024
Supply Current-Max (mA)
125
Package Equivalence Code
TSSOP56,.3,20
Clock Frequency-Max (MHz)
40
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
240
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
20