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Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 72815LBLB15BGI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B121
  • Memory Width
    18
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Memory IC Type
    BI-DIRECTIONAL FIFO
  • Operating Mode
    SYNCHRONOUS
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    1KX18
  • Number of Terminals
    121
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    10
  • Number of Words Code
    1K
  • Memory Density (bits)
    18432
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    1024
  • Standby Current-Max (A)
    0.01
  • Supply Current-Max (mA)
    100
  • Package Equivalence Code
    BGA121,11X11,50
  • Clock Frequency-Max (MHz)
    66.7
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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