72801L15TF by Integrated Device Technology, Inc. | Sourcengine

Integrated Device Technology, Inc. 72801L15TF

Lifecycle status
Transferred
Description
TQFP 10.00x10.00x1.40 mm 0.50mm Pitch
Category
Semiconductors Memory ICs FIFOs OTHER FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Width
10 mm
Length
10 mm
Cycle Time
15 ns
Technology
CMOS
JESD-30 Code
S-PQFP-G64
Memory Width
9
Organization
256X9
Package Code
LFQFP
JESD-609 Code
e0
Output Enable
YES
Package Shape
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory Density
2304 bit
Memory IC Type
OTHER FIFO
Operating Mode
SYNCHRONOUS
Terminal Pitch
0.5 mm
Access Time-Max
10 ns
Number of Words
256 words
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
Seated Height-Max
1.6 mm
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Supply Current-Max
60 mA
Number of Functions
2
Number of Terminals
64
Standby Current-Max
0.01 Amp
Number of Words Code
256
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
QFP64,.47SQ,20
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Clock Frequency-Max (fCLK)
66.7 MHz
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
30