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7252L50CB

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 7252L50CB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-XDIP-T48
  • Memory Width
    18
  • Organization
    1KX18
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    18432 bit
  • Memory IC Type
    BI-DIRECTIONAL FIFO
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    2.54 mm
  • Access Time-Max
    50 ns
  • Number of Words
    1024 words
  • Screening Level
    38535Q/M;38534H;883B
  • Terminal Finish
    TIN LEAD
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Supply Current-Max
    170 mA
  • Number of Terminals
    48
  • Standby Current-Max
    0.004 Amp
  • Number of Words Code
    1K
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC
  • Package Equivalence Code
    DIP48,.6
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Nom (Vsup)
    5 V

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7252L50CB
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7252L50CB