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72511L50G

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 72511L50G
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    S-XPGA-P68
  • Memory Width
    18
  • Organization
    1KX18
  • Package Code
    PGA
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • Memory Density
    18432 bit
  • Memory IC Type
    BI-DIRECTIONAL FIFO
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    2.54 mm
  • Access Time-Max
    50 ns
  • Number of Words
    1024 words
  • Terminal Finish
    TIN LEAD
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    PERPENDICULAR
  • Supply Current-Max
    230 mA
  • Number of Terminals
    68
  • Standby Current-Max
    0.03 Amp
  • Number of Words Code
    1K
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC
  • Package Equivalence Code
    PGA68,11X11
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    5 V
  • Clock Frequency-Max (fCLK)
    15.4 MHz
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    260

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72511L50G
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72511L50G