723676L15PF by Integrated Device Technology, Inc. | Sourcengine

Lifecycle status
Transferred
Description
TQFP 20.00x14.00x1.40 mm 0.50mm Pitch
Category
Semiconductors Memory Ics Fifos Bi Directional Fifo

SB Code
8542.32.00.70
HTS Code
8542.32.00.71
ECCN Governance
EAR
ECCN
EAR99

Width
14 mm
Length
20 mm
Cycle Time
15 ns
Technology
CMOS
JESD-30 Code
R-PQFP-G128
Memory Width
36
Organization
8KX36
Package Code
LFQFP
Sub Category
FIFOs
JESD-609 Code
e0
Output Enable
YES
Package Shape
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory Density
294912 bit
Memory IC Type
BI-DIRECTIONAL FIFO
Operating Mode
SYNCHRONOUS
Power Supplies
5 V
Terminal Pitch
0.5 mm
Access Time-Max
10 ns
Number of Words
8192 words
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
Seated Height-Max
1.6 mm
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Additional Feature
MAILBOX
Number of Functions
1
Number of Terminals
128
Standby Current-Max
0.001 Amp
Number of Words Code
8K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
QFP128,.63X.87,20
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Clock Frequency-Max (fCLK)
66.7 MHz
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
30