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723614L30PQF

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 723614L30PQF
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    S-PQFP-G132
  • Memory Width
    36
  • Organization
    128X36
  • Package Code
    BQFP
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    BI-DIRECTIONAL FIFO
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.635 mm
  • Access Time-Max
    15 ns
  • Number of Words
    128 words
  • Terminal Finish
    TIN LEAD
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Supply Current-Max
    1 mA
  • Number of Terminals
    132
  • Standby Current-Max
    1.0E-6 Amp
  • Number of Words Code
    128
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    SPQFP132,1.1SQ
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    5 V
  • Clock Frequency-Max (fCLK)
    33.4 MHz
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    225

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723614L30PQF
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723614L30PQF