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72225LB25PFGI

Renesas Electronics Corp.

Renesas Electronics Corp. 72225LB25PFGI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PQFP-G64
  • Memory Width
    18
  • Output Enable
    YES
  • Package Shape
    RECTANGULAR
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e3
  • Memory IC Type
    BI-DIRECTIONAL FIFO
  • Operating Mode
    SYNCHRONOUS
  • Cycle Time (ns)
    25
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Matte Tin (Sn) - annealed
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Memory Organization
    1KX18
  • Number of Functions
    1
  • Number of Terminals
    64
  • Access Time-Max (ns)
    15
  • Number of Words Code
    1K
  • Memory Density (bits)
    18432
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    1024
  • Standby Current-Max (A)
    0.005
  • Supply Current-Max (mA)
    60
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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72225LB25PFGI
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72225LB25PFGI