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71V424VL10PHGI

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 71V424VL10PHGI
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G44
  • Memory Width
    8
  • Package Code
    TSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e3
  • Memory IC Type
    APPLICATION SPECIFIC SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Matte Tin (Sn) - annealed
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Memory Organization
    512KX8
  • Number of Terminals
    44
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    10
  • Number of Words Code
    512K
  • Memory Density (bits)
    4194304
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    524288
  • Standby Current-Max (A)
    0.01
  • Standby Voltage-Min (V)
    3
  • Supply Current-Max (mA)
    165
  • Package Equivalence Code
    TSOP44,.46,32
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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71V424VL10PHGI