Integrated Device Technology, Inc. 71V2556XS100BQI
  • ECCN
    3A991.B.2.A
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Width
    13 mm
  • Length
    15 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B165
  • Memory Width
    36
  • Organization
    128KX36
  • Package Code
    TBGA
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    4718592 bit
  • Memory IC Type
    ZBT SRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Access Time-Max
    5 ns
  • Number of Words
    131072 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • Seated Height-Max
    1.2 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    PIPELINED ARCHITECTURE
  • Supply Current-Max
    260 mA
  • Number of Functions
    1
  • Number of Terminals
    165
  • Standby Current-Max
    0.045 Amp
  • Standby Voltage-Min
    3.14 V
  • Number of Words Code
    128K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    BGA165,11X15,40
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.465 V
  • Supply Voltage-Min (Vsup)
    3.135 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Clock Frequency-Max (fCLK)
    100 MHz
  • Moisture Sensitivity Level
    3

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