Integrated Device Technology, Inc. 71T75702S75PFI8
  • ECCN
    3A991.B.2.A
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Width
    14 mm
  • Length
    20 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PQFP-G100
  • Memory Width
    36
  • Organization
    512KX36
  • Package Code
    LQFP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    18874368 bit
  • Memory IC Type
    ZBT SRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.65 mm
  • Access Time-Max
    7.5 ns
  • Number of Words
    524288 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • Seated Height-Max
    1.6 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Additional Feature
    FLOW-THROUGH ARCHITECTURE
  • Supply Current-Max
    295 mA
  • Number of Functions
    1
  • Number of Terminals
    100
  • Standby Current-Max
    0.06 Amp
  • Standby Voltage-Min
    2.38 V
  • Number of Words Code
    512K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    QFP100,.63X.87
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    2.625 V
  • Supply Voltage-Min (Vsup)
    2.375 V
  • Supply Voltage-Nom (Vsup)
    2.5 V
  • Clock Frequency-Max (fCLK)
    100 MHz
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    225
  • Time@Peak Reflow Temperature-Max (s)
    20

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71T75702S75PFI8