Integrated Device Technology, Inc. 71T65902S80BQ
  • ECCN
    3A991.B.2.A
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B165
  • Memory Width
    18
  • Organization
    512KX18
  • Package Code
    BGA
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    9437184 bit
  • Memory IC Type
    ZBT SRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Access Time-Max
    8 ns
  • Number of Words
    524288 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    250 mA
  • Number of Terminals
    165
  • Standby Current-Max
    0.04 Amp
  • Standby Voltage-Min
    2.38 V
  • Number of Words Code
    512K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    BGA165,11X15,40
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    2.5 V
  • Clock Frequency-Max (fCLK)
    95 MHz
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    225
  • Time@Peak Reflow Temperature-Max (s)
    30

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71T65902S80BQ