7133LA20PF by Integrated Device Technology, Inc. | Sourcengine

Integrated Device Technology, Inc. 7133LA20PF

Lifecycle status
Transferred
Description
TQFP 14.00x14.00x1.40 mm 0.50mm Pitch
Category
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

Width
14 mm
Length
14 mm
I/O Type
COMMON
Technology
CMOS
JESD-30 Code
S-PQFP-G100
Memory Width
16
Organization
2KX16
Package Code
LFQFP
JESD-609 Code
e0
Package Shape
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory Density
32768 bit
Memory IC Type
MULTI-PORT SRAM
Operating Mode
ASYNCHRONOUS
Terminal Pitch
0.5 mm
Access Time-Max
20 ns
Number of Ports
2
Number of Words
2048 words
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
Seated Height-Max
1.6 mm
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Supply Current-Max
280 mA
Number of Functions
1
Number of Terminals
100
Standby Current-Max
0.0015 Amp
Standby Voltage-Min
2 V
Number of Words Code
2K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Package Equivalence Code
QFP100,.63SQ,20
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
20