71321LA25TF by Integrated Device Technology, Inc. | Sourcengine

Integrated Device Technology, Inc. 71321LA25TF

Lifecycle status
Transferred
Description
TQFP 10.00x10.00x1.40 mm 0.50mm Pitch
Category
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
10
Length (mm)
10
JESD-30 Code
S-PQFP-G64
Memory Width
8
Package Code
TFQFP
Package Shape
SQUARE
Package Style
FLATPACK, THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e0
Memory IC Type
MULTI-PORT SRAM
Operating Mode
ASYNCHRONOUS
Number of Ports
2
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Additional Feature
INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP
Memory Organization
2KX8
Number of Functions
1
Number of Terminals
64
Terminal Pitch (mm)
0.5
Access Time-Max (ns)
25
Number of Words Code
2K
Memory Density (bits)
16384
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.2
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
2048
Standby Current-Max (A)
0.0015
Standby Voltage-Min (V)
2
Supply Current-Max (mA)
170
Package Equivalence Code
QFP64,.47SQ,20
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
240
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
30