70V3319S133BFG8 by Integrated Device Technology, Inc. | Sourcengine

Integrated Device Technology, Inc. 70V3319S133BFG8

Lifecycle status
Transferred
RoHS
RoHS compliant
REACH
REACH compliant
Description
Application Specific SRAM, 256KX18, 4.2ns, CMOS, PBGA208
Category
Semiconductors Memory ICs SRAMs APPLICATION SPECIFIC SRAM

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
S-PBGA-B208
Memory Width
18
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Memory IC Type
APPLICATION SPECIFIC SRAM
Operating Mode
SYNCHRONOUS
Number of Ports
2
Parallel/Serial
PARALLEL
Terminal Finish
TIN SILVER COPPER
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Additional Feature
PIPELINED OR FLOW-THROUGH ARCHITECTURE
Memory Organization
256KX18
Number of Functions
1
Number of Terminals
208
Terminal Pitch (mm)
0.8
Access Time-Max (ns)
4.2
Number of Words Code
256K
Memory Density (bits)
4718592
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Supply Voltage-Max (V)
3.45
Supply Voltage-Min (V)
3.15
Supply Voltage-Nom (V)
3.3
Number of Words (words)
262144
Standby Current-Max (A)
0.03
Standby Voltage-Min (V)
3.15
Supply Current-Max (mA)
400
Package Equivalence Code
BGA208,17X17,32
Clock Frequency-Max (MHz)
133
Moisture Sensitivity Level
3
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0