ProductsManufacturers
Events
Send an RFQBOM Tool

70V27WL55BF

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 70V27WL55BF
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B144
  • Memory Width
    16
  • Organization
    32KX16
  • Package Code
    FBGA
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    524288 bit
  • Memory IC Type
    APPLICATION SPECIFIC SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    55 ns
  • Number of Ports
    2
  • Number of Words
    32768 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    180 mA
  • Number of Terminals
    144
  • Standby Current-Max
    0.003 Amp
  • Standby Voltage-Min
    3 V
  • Number of Words Code
    32K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    BGA144,13X13,32
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Moisture Sensitivity Level
    3

0 suppliers available to buy or to bid for 70V27WL55BF

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
70V27WL55BF
Send an RFQ
70V27WL55BF