ProductsManufacturers
Events
Send an RFQBOM Tool

70V27S55BF

Renesas Electronics Corp.

Renesas Electronics Corp. 70V27S55BF
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B144
  • Memory Width
    16
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Memory IC Type
    APPLICATION SPECIFIC SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Number of Ports
    2
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    32KX16
  • Number of Terminals
    144
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    55
  • Number of Words Code
    32K
  • Memory Density (bits)
    524288
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    32768
  • Standby Current-Max (A)
    0.006
  • Standby Voltage-Min (V)
    3
  • Supply Current-Max (mA)
    225
  • Package Equivalence Code
    BGA144,13X13,32
  • Moisture Sensitivity Level
    3
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

0 suppliers available to buy or to bid for 70V27S55BF

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
70V27S55BF
Send an RFQ
70V27S55BF