70V09L20PFG by Renesas Electronics Corp. | Sourcengine

Renesas Electronics Corp. 70V09L20PFG

Lifecycle status
Contact Mfr
RoHS
RoHS compliant
REACH
REACH compliant
Description
SRAM Chip Async Dual 3.3V 1M-bit 128K x 8 20ns 100-Pin TQFP Tray
Category
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
3A991.b.2.b
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
14
Length (mm)
14
JESD-30 Code
S-PQFP-G100
Memory Width
8
Package Code
LFQFP
Package Shape
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e3
Memory IC Type
MULTI-PORT SRAM
Operating Mode
ASYNCHRONOUS
Number of Ports
2
Parallel/Serial
PARALLEL
Terminal Finish
MATTE TIN
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Memory Organization
128KX8
Number of Functions
1
Number of Terminals
100
Terminal Pitch (mm)
0.5
Access Time-Max (ns)
20
Number of Words Code
128K
Memory Density (bits)
1048576
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.6
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
3
Supply Voltage-Nom (V)
3.3
Number of Words (words)
131072
Standby Current-Max (A)
0.003
Standby Voltage-Min (V)
3
Supply Current-Max (mA)
205
Package Equivalence Code
QFP100,.63SQ,20
Moisture Sensitivity Level
3
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0